BERGQUIST LIQUI FORM TLF 4500CGEL SF

BERGQUIST LIQUI FORM TLF 4500CGEL SF

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4.5 W/mK , 1 component, cure in place liquid thermal interface material based on silicone free chemistry. Key benefits: » Low assembly stress eliminating component damage & failure during assembly » Excellent vertical gap stability for long term reliability & performance » Exhibits no cracking/low voiding in cure condition » Low dispensing viscosity & high thixotropy » Ease of dispensing with high shot consistency for high throughput manufacturing » Excellent wet out for lower thermal impedance Discover our customer's success story: https://www.henkel-adhesives.com/us/en/insights/all-insights/success-stories/TLF-4500-C-GEL-SF.html

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